PRODUCTS
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Tape
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Glue
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Basic organic silicon material
TS-9109
Product Description:
TS-9109 is a kind of glue that adjusts the adhesive force by heating according to the process requirements. It can provide high adhesive force at room temperature. When heated above a certain temperature, the adhesive force is quickly lost. It is made of a special formula and finely balanced packing filler silicone pressure-sensitive adhesive to provide high adhesion before heating and easy peeling performance after heating. It is resistant to acids, alkalis and most solvents, and has little stress on the surface of the backing after curing.
Applications:
Where temporary fixation is required, such as the fixation and protection of glass, wafer, semiconductor cutting processing, temporary fixation when the back of the wafer is thinned, it can also be used for MLCC slitting and positioning, and copper foil graphene transfer. After the processing is completed, the fixed part can be easily released by heating in less than 2 minutes. The required release temperature can be customized from 90 degrees to 200 degrees. After debonding, there will be no residual glue on the back sticker.
Product performance:
It can be applied to the film by roll coating, or sprayed on the surface that needs temporary fixation. After heating, it can be easily desorbed by the relative sliding of the two surfaces.
Note: The above data are typical and representative values, not for SPEC purposes. We recommend that customers test the applicability of the product according to their actual applications.
Packaging, storage and transportation:
In the original packaging, the storage temperature should not exceed 60 degrees at 10-30 degrees Celsius, and it should be stored in 40-60% humidity, away from direct sunlight. The validity period is 6 months.
Safety and environmental protection:
It meets ROHS2.0 and halogen-free requirements, and meets REACH SVHC requirements.
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